Panasonic's Electronics Assembly Group offers highly reliable component placement equipment for any mix, any volume circuit manufacturing via world-class component placement, inspection and screen printing solutions. Also available is a broad range of equipment and solutions designed to advance your ability to manufacture semiconductors and other microelectronic applications - Panasonic's laser, flip chip, die attach, wire bonder, plasma cleaner, metrology and micro-machining technologies drive costs lower while increasing yield.

Our expertise as a manufacturer and provider of industry-leading SMT and back-end microelectronics equipment, engineering and consultancy solutions drive your productivity while reducing production costs and time to market.

Our lines of flexible, modular, small footprint placement machines - coupled with our superior software and attention to semiconductor industry standards, such as CamX & IPC9850, and energy-saving design - enable highly accurate, repeatable, optimized chip placement. All while reducing inventory, PCB rework, data preparation and model changeover time - and maintaining your profit.

Tap the power of a world-class manufacturing organization. Total manufacturing solutions: Any time, any where. Any mix, any volume.