The evolutionary Panasonic NPM-D3 continues in the steps of its award-winning predecessor with interchangeable dispensing, placement, and inspection heads; however, new enhancements further increase productivity. The NPM-D3 now handles a component range spanning 03015mm microchips to massive 100x90mm components up to 28mm tall, as well as Package on Package applications.
A new base frame, redesigned placement head, and Multi Recognition Camera improve placement accuracy by 25%, while boosting IPC-9850 throughput 30% to an industry-leading 38,078 cph per square meter. The new Multi Recognition Camera provides component alignment, defect inspection, chip thickness, and 3D coplanarity inspection in a single pass, which helps ensure high productivity and quality control.
With its advanced board handling design, the NPM-D3 maximizes area productivity. In single lane mode, the NPM-D3 handles 750mm long boards ideal for LED panels. With a simple software switch, the NPM-D3 automatically converts to dual lane “shared” or “independent” mode. For the highest efficiency, the NPM-D3 offers auto board support, feeder cart hot-swap, intelligent feeder anywhere, and 2D-coded nozzle anywhere for changeover without disrupting production. The NPM-D3 enhances product quality with thermal compensation, board warp mapping, a 20-tray direct tray cart, complete component monitoring, and material verification and control.
As always, manufacturers can scale NPM production lines to meet production needs while conserving investments until production or technology requirements mandate. OEMs and EMS providers can reconfigure the machine heads in approximately 15 minutes—maximizing flexibility, minimizing ROI, and protecting assets. The NPM-D3 also incorporates existing feeders, carts, and nozzles to minimize investment and inventory expenses.
Features & Benefits
- Compact footprint - scale production to your factory needs
- Quick-change feeder carts, nozzle banks, and process heads
- Compatible with CM- & AM-series intelligent feeders & nozzles
- Board warp detection, Adaptive Process Control (APC), and Auto Board Support Pin
- Industry's first 3D Multi Recognition Camera
- Lightweight 16-nozzle head (for 84,000 cph)
- Increased placement accuracy to 25um (cpk ≥1.0)