With over 25 years industry experience fabricating semiconductors, Panasonic is pleased to introduce our latest plasma dicing solution: APX300. This machine is ideal for thin, brittle, and ultra-small die packages.
Achieve ultra-narrow dicing streets at 20μm for thin wafers down to 50μm.
And unlike blade dicing, plasma dicing will not induce edge chipping or surface layer stress damage related to mechanical heat.
Features & Benefits
- Narrow aspect ratio of 2:1