MD-P200 Die Bonder

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Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer supply, pre-centering, bond head and dispenser work in parallel to achieve high-throughput.

The MD-P200 solves today's need for small and thin die bonding and offers capabilities for tomorrow's challenges as well. Accurate die pre-centering ensures minimal die tilt and a novel ejector design handles thin dies. Functionality for multi-die packages is also available.

Features & Benefits

  • Wafer mapping software capability
  • Low bond force option
  • Epoxy writing or pin transfer
  • High accuracy
  • Flexible for multiple die
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