Microelectronics Equipment

High-quality & high-precision equipment for back-end packaging supporting a variety of technologies


Plasma Cleaner PSX307

Parallel plate plasma cleaning

Panasonic Dry Etcher & Plasma Dicer APX300

Plasma Dicer APX300

Non-contact dicing, excellent for thin & brittle wafers


Die Bonder MDP-200

Small and ultra-thin die bonding

Flip Chip Bonder MDP-300

Flip Chip Bonder MDP-300

Process-flexible flip chip bonder with fast cycle times


UA3P 3D Profilometer

Precision nanometer-level measuring accuracy

APX300-S Dry Etcher

APX300-S Dry Etcher

Best-in-class dry etching equipment for silicon and compound materials

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